Cover tape and electronic component package
A cover tape (10) for an electronic component package, the cover tape comprising a base material layer (3) and a sealant layer (2) laminated to one surface of the base material layer (3), wherein the sealant layer (2) contains a (meth)acrylate copolymer (A) and a petroleum resin (B).
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Hauptverfasser: | , |
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Format: | Patent |
Sprache: | chi ; eng |
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Online-Zugang: | Volltext bestellen |
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Zusammenfassung: | A cover tape (10) for an electronic component package, the cover tape comprising a base material layer (3) and a sealant layer (2) laminated to one surface of the base material layer (3), wherein the sealant layer (2) contains a (meth)acrylate copolymer (A) and a petroleum resin (B). |
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