Cover tape and electronic component package

A cover tape (10) for an electronic component package, the cover tape comprising a base material layer (3) and a sealant layer (2) laminated to one surface of the base material layer (3), wherein the sealant layer (2) contains a (meth)acrylate copolymer (A) and a petroleum resin (B).

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Bibliographische Detailangaben
Hauptverfasser: ABE, HIROKI, MASUI, KEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A cover tape (10) for an electronic component package, the cover tape comprising a base material layer (3) and a sealant layer (2) laminated to one surface of the base material layer (3), wherein the sealant layer (2) contains a (meth)acrylate copolymer (A) and a petroleum resin (B).