Pad-in-a-bottle and single platen Chemical Mechanical-Planarization for back-end applications

A single platen Chemical Mechanical Planarization (CMP) process using a novel pad-in-a-bottle (PIB) technology and PIB type CMP slurries for back-end CMP application is described to replace multiple (such as three) platens Chemical Mechanical Planarization (CMP) process for back-end CMP applications...

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Bibliographische Detailangaben
Hauptverfasser:	SCHLUETER, JAMES A, PHILIPOSSIAN, ARA, LANGAN, JOHN G, VACASSY, ROBERT, SHI, XIAOBO, O'NEILL, MARK LEONARD, SAMPURNO, YASA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A single platen Chemical Mechanical Planarization (CMP) process using a novel pad-in-a-bottle (PIB) technology and PIB type CMP slurries for back-end CMP application is described to replace multiple (such as three) platens Chemical Mechanical Planarization (CMP) process for back-end CMP applications. The single platen with a single polishing pad is used for the whole back-end CMP process comprising metal bulk, metal soft landing, and metal barrier CMP.