Chip-on-film structure and electronic device

The present disclosure provides a chip-on-film structure including: a flexible circuit board, a driver chip, and a heat dissipating patch. The flexible circuit board includes a substrate and a circuit wiring arranged on the substrate. The driver chip is arranged on the flexible circuit board, electr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN, HSIN-EN, LEO, HON-YUAN, WEI, HONG-YUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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