Chip-on-film structure and electronic device
The present disclosure provides a chip-on-film structure including: a flexible circuit board, a driver chip, and a heat dissipating patch. The flexible circuit board includes a substrate and a circuit wiring arranged on the substrate. The driver chip is arranged on the flexible circuit board, electr...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present disclosure provides a chip-on-film structure including: a flexible circuit board, a driver chip, and a heat dissipating patch. The flexible circuit board includes a substrate and a circuit wiring arranged on the substrate. The driver chip is arranged on the flexible circuit board, electrically connected with the circuit wiring, and used for sending or receiving electrical signals through the circuit wiring. The heat dissipating patch is glued to the drive chip on a side away from the flexible circuit board. The dissipating patch covers the drive chip at least partially, and extends to the flexible circuit board along the drive chip. The present disclosure also provides an electronic device. |
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