Chip-on-film structure and electronic device

Chip-on-film structure and electronic device

The present disclosure provides a chip-on-film structure including: a flexible circuit board, a driver chip, and a heat dissipating patch. The flexible circuit board includes a substrate and a circuit wiring arranged on the substrate. The driver chip is arranged on the flexible circuit board, electr...

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Hauptverfasser: CHEN, HSIN-EN, LEO, HON-YUAN, WEI, HONG-YUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHEN, HSIN-EN
LEO, HON-YUAN
WEI, HONG-YUN
description The present disclosure provides a chip-on-film structure including: a flexible circuit board, a driver chip, and a heat dissipating patch. The flexible circuit board includes a substrate and a circuit wiring arranged on the substrate. The driver chip is arranged on the flexible circuit board, electrically connected with the circuit wiring, and used for sending or receiving electrical signals through the circuit wiring. The heat dissipating patch is glued to the drive chip on a side away from the flexible circuit board. The dissipating patch covers the drive chip at least partially, and extends to the flexible circuit board along the drive chip. The present disclosure also provides an electronic device.
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Chip-on-film structure and electronic device
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