Method of processing substrate and substrate processing apparatus

A liquid of a hydrophobizing agent is supplied to a surface of a substrate (W) to form a liquid film of the hydrophobizing agent that covers the entire surface region of the substrate (W). A liquid of a first organic solvent having a lower surface tension than water is supplied to the surface of the...

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Bibliographische Detailangaben
Hauptverfasser:	OATO, AKIRA, TANAKA, TAKAYOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CLEANING CLEANING IN GENERAL DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	A liquid of a hydrophobizing agent is supplied to a surface of a substrate (W) to form a liquid film of the hydrophobizing agent that covers the entire surface region of the substrate (W). A liquid of a first organic solvent having a lower surface tension than water is supplied to the surface of the substrate (W) covered with the liquid film of the hydrophobizing agent so that the liquid of the hydrophobizing agent on the substrate (W) is replaced with the liquid of the first organic solvent. A liquid of a second organic solvent having a lower surface tension than the first organic solvent is supplied to the surface of the substrate (W) covered with the liquid film of the first organic solvent so that the liquid of the first organic solvent on the substrate is replaced (W) with the liquid of the second organic solvent. The substrate (W) that the liquid of the second organic solvent has adhered, is dried.