Enhanced cooling package for improved thermal management for electrical components

An electrical component package includes a folded heat sink for increased heat dissipation. The internal components of the package include an electrical component, a lead frame, a conductive clip, and terminal leads, which are electrically and mechanically interconnected. A packaging material is utilized to form a mold for encapsulating the internal components, the mold including a portion that is recessed. A heat sink is provided for heat dissipation and includes a first planar portion that extends from the lead frame, a second planar portion that is in spaced relation from the recessed portion of the mold, and a fold portion that is integral with and extends between the first and second planar portions.