Film forming method, resin layer forming apparatus, film forming apparatus and circuit board with electromagnetic wave shield characterized by preventing the poor connection between an electromagnetic wave shielding film and a ground wiring and realizing thinning

The present invention provides a film forming method, a resin layer forming apparatus, a film forming apparatus and a circuit board with an electromagnetic wave shield, which can prevent the poor connection between an electromagnetic wave shielding film and a ground wiring and also can realize thinning. The film forming method of an embodiment is the film forming method that forms the electromagnetic wave shielding film (150) covering the electronic part (120) for the circuit board (100) having the electronic part (120) and the ground wiring (110). The film forming method includes: a resin layer forming process that forms the resin layer (140) sealing the interior of the metal frame (130) via the first resin, wherein, the metal frame (130) encloses the electronic part (120) on the circuit board (100) and contacts the ground wiring (110); and a film forming process that uses the manner of contacting the metal frame (130) to allow the electromagnetic wave shielding film (150) covering the top surface of the res