System for uniform temperature control of cluster platforms

Aspects of the disclosure provided herein generally relate to a fluid flow network configured to cool subsystems of a substrate processing system. Aspects of the disclosure provide a fluid flow network and method that adjusts the flow of the cooling fluid through each subsystem of the substrate proc...

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Bibliographische Detailangaben
Hauptverfasser:	SAVANDAIAH, KIRANKUMAR NEELASANDRA, DESAI, PRASHANT A, SHIRAHATTI, LAKSHMIKANTH KRISHNAMURTHY, BREZOCZKY, THOMAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	Aspects of the disclosure provided herein generally relate to a fluid flow network configured to cool subsystems of a substrate processing system. Aspects of the disclosure provide a fluid flow network and method that adjusts the flow of the cooling fluid through each subsystem of the substrate processing system. The methods described herein can include maintaining a flow rate of the cooling fluid through each subsystem over a range of cooling fluid pressures. The methods described herein can further include configuring the fluid flow network to equalize a flow rate of the cooling fluid through similar subsystems such that the flow rate through each subsystem is similar without adjustment.