Tapered upper electrode for uniformity control in plasma processing

An upper electrode for use in a substrate processing system includes a lower surface. The lower surface includes a first portion and a second portion and is plasma-facing. The first portion includes a first surface region that has a first thickness. The second portion includes a second surface regio...

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Bibliographische Detailangaben
Hauptverfasser:	HOLLAND, JOHN PATRICK, MANKIDY, PRATIK JACOB, MARAKHTANOV, ALEXEI, LLERA, ANTHONY DELA, SHIN, HYUNG-JOO, CHEN, ZHI-GANG, KIM, HALEY
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An upper electrode for use in a substrate processing system includes a lower surface. The lower surface includes a first portion and a second portion and is plasma-facing. The first portion includes a first surface region that has a first thickness. The second portion includes a second surface region that has a varying thickness such that the second portion transitions from a second thickness to the first thickness.