Lead frame and packaging method
The present invention provides a lead frame, which includes: at least one ductile structure, wherein the ductile structure includes a bond area, a die paddle, or a lead finger; and at least one sacrificial structure, wherein the sacrificial structure is connected between the corresponding ductile st...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The present invention provides a lead frame, which includes: at least one ductile structure, wherein the ductile structure includes a bond area, a die paddle, or a lead finger; and at least one sacrificial structure, wherein the sacrificial structure is connected between the corresponding ductile structure and a corresponding near portion in the lead frame, wherein the near portion is a portion of the lead frame close to the ductile structure. |
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