Method for removing mono- to penta-fluoride from molybdenum, and method for manufacturing semiconductor device

Provided are: a method for removing MoFx or MoFx and MoOFx, wherein a halogen-containing gas is brought into contact with a member having MoFx or MoFx and MoOFx deposited or coated thereon (where x represents a number greater than 0 and less than 6) to remove the MoFx or the MoFx and MoOFx from the...

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Bibliographische Detailangaben
Hauptverfasser:	KIKUCHI, AKIOU, SHINAGAWA, MASATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Provided are: a method for removing MoFx or MoFx and MoOFx, wherein a halogen-containing gas is brought into contact with a member having MoFx or MoFx and MoOFx deposited or coated thereon (where x represents a number greater than 0 and less than 6) to remove the MoFx or the MoFx and MoOFx from the member; and a method for manufacturing a semiconductor device, the method comprising said removal method. By using these methods, provided are: a method for removing deposited or coated matter from a member on which MoFx or MoFx and MoOFx, which are incorporated into MoF6 as impurities, are deposited or coated; and a method for manufacturing a semiconductor device, the method comprising a step for removing deposited or coated matter from a manufacturing apparatus for a semiconductor device on which MoFx or MoFx and MoOFx are deposited or coated, wherein clogging or contamination of the manufacturing apparatus can be avoided.