Liquid compression molding material, electronic component, semiconductor device and method for producing semiconductor device

The present invention provides a liquid compression molding material which is composed of an epoxy resin composition that contains (A) an epoxy resin, (B) a curing accelerator, (C) a filler and (D) an elastomer, wherein the blending ratio of the filler (C) relative to the epoxy resin composition is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAITO, YU, KAMIMURA, TSUYOSHI, OE, TAKAYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a liquid compression molding material which is composed of an epoxy resin composition that contains (A) an epoxy resin, (B) a curing accelerator, (C) a filler and (D) an elastomer, wherein the blending ratio of the filler (C) relative to the epoxy resin composition is 73.0% by mass or more and the blending ratio of the elastomer (D) relative to the total amount of the components of the epoxy resin composition excluding the filler (C) is 7.0% by mass or more.