New organosilicon compound, new crosslinking agent, curable composition, prepreg, laminate body, metal-clad laminate, and circuit board
The present invention provides: a novel organosilicon compound suitable for use as a crosslinking agent or the like; a novel crosslinking agent; a curable composition; a prepreg; a laminate; a metal-clad laminated board; and a wiring board. The organosilicon compound is represented by formula (1m)....
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present invention provides: a novel organosilicon compound suitable for use as a crosslinking agent or the like; a novel crosslinking agent; a curable composition; a prepreg; a laminate; a metal-clad laminated board; and a wiring board. The organosilicon compound is represented by formula (1m). (In the formula, M is a single bond or an optionally substituted alkylene group having 1-20 carbon atoms. The benzene ring may have a substituent group. The position of substitution of the vinyl group on the benzene ring is a meta position. n is an integer between 2 and 4. R is a hydrogen atom, a hydroxyl group or an organic group, and if R is an organic group, an atom that bonds to Si is C.). |
---|