Waterproof MEMS pressure sensor package with a metal lid and an embedded ePTFE filter and process of making

Microelectromechanical system (MEMS) packages and methods of making thereof. A MEMS package includes at least one MEMS device disposed on a base substrate and a lid disposed on the base substrate. The lid is configured to enclose the at least one MEMS device. The lid includes a body portion configur...

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Bibliographische Detailangaben
Hauptverfasser:	SHARMA, MONISHA, WAKHARKAR, VIJAY, BRIOSCHI, ROBERTO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEPARATION TRANSPORTING
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Beschreibung
Zusammenfassung:	Microelectromechanical system (MEMS) packages and methods of making thereof. A MEMS package includes at least one MEMS device disposed on a base substrate and a lid disposed on the base substrate. The lid is configured to enclose the at least one MEMS device. The lid includes a body portion configured to be coupled to the base substrate, a ceiling portion and a membrane. The ceiling portion, the body portion and the ceiling portion form a cavity in which the at least one MEMS device is enclosed. The membrane is configured to be in contact with the ceiling portion. The membrane is formed from a filtering fabric and is configured to substantially block one or more of liquids and contaminants from passing into the cavity.