Method of manufacturing semiconductor structure

A method of manufacturing a semiconductor structure including the following steps is provided. A substrate is provided. The substrate includes a first region and a second region. A first dielectric layer is formed on the substrate in the first region. A second dielectric layer is formed on the subst...

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Bibliographische Detailangaben
Hauptverfasser: CHEN, HWI-HUANG, HUANG, WEIING, HSU, MING-SHUN, CHEN, WEN-JI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A method of manufacturing a semiconductor structure including the following steps is provided. A substrate is provided. The substrate includes a first region and a second region. A first dielectric layer is formed on the substrate in the first region. A second dielectric layer is formed on the substrate in the second region. A first gate is formed on the first dielectric layer. A second gate is formed on the second dielectric layer. A first spacer is formed on a sidewall of the first gate, and a second spacer is formed on a sidewall of the second gate at the same time. A patterned photoresist layer is formed. The patterned photoresist layer covers the first spacer and exposes the second spacer. The second spacer is removed by using the patterned photoresist layer as a mask. After the second spacer is removed, the patterned photoresist is removed. A third spacer is formed on a sidewall of the first spacer, and a fourth spacer is formed on the sidewall of the second gate at the same time.