Probe card and wafer probing assembly thereof

The disclosure relates to a probe card and a wafer probing assembly thereof. The wafer probing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure elements. The printed circuit board includes a bottom surface and a plurality of first contacts disposed on the bottom surface. The space transformer includes a top surface and a plurality of second contacts, the second contacts are disposed on the top surface and corresponding to the first contacts. The copper pillars are respectively between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure elements are disposed on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.