Cleaning agent composition for post-CMP step

The purpose of the present invention is to provide a cleaning agent composition that is for a post-CMP step and that exhibits excellent removal performance and attachment inhibition for metal residues or organic residues remaining on a polished surface obtained by flattening a substrate, and that ha...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BABU, SURYADEVARA V, VENKATARONAPPA, GOLLAHALLI ARUNKUMAR, FUJII, YUDAI, TONOYA, MASASHI, VEGI, SRI SIVA RAMA KRISHNA HANUP, SEO, JI-HOON, MIZUSHIMA, CHIHO, OTHMAN, ALI, HARIGAE, TAKAKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DETERGENT COMPOSITIONS DETERGENTS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a cleaning agent composition that is for a post-CMP step and that exhibits excellent removal performance and attachment inhibition for metal residues or organic residues remaining on a polished surface obtained by flattening a substrate, and that has excellent corrosion inhibition. The present invention relates to: a cleaning agent composition for a post-CMP step in a semiconductor production process, the composition including (1A) at least one compound selected from the group consisting of N-vinyllactam-based polymers and nonionic surfactants including an alkylene oxide adduct of an alcohol having 6 or more carbon atoms, (1B) an aliphatic amine, and (1C) at least one corrosion inhibitor selected from the group consisting of nitrogen-containing heterocyclic compounds and carboxylate compounds; and a cleaning agent composition for a post-CMP step, the composition including (2A) at least one compound selected from the group consisting of N-vinyllactam-based pol