Heat-conductive silicone composition

The purpose of the present invention, which has been developed in view of the foregoing circumstances, is to provide: a heat-conductive silicone composition in which an increase in viscosity is suppressed when a heat-conductive filler is highly filled; and a heat-conductive silicone cured product wh...

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Bibliographische Detailangaben
Hauptverfasser:	ITO, TAKANORI, HIRONAKA, YUYA, ENDO, AKIHIRO, TSUKADA, JUNICHI, MIYANO, MEGUMI, ISHIHARA, YASUHISA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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