Heat-conductive silicone composition

The purpose of the present invention, which has been developed in view of the foregoing circumstances, is to provide: a heat-conductive silicone composition in which an increase in viscosity is suppressed when a heat-conductive filler is highly filled; and a heat-conductive silicone cured product which has good thermal conductivity and excellent handleability. The heat-conductive silicone composition is characterized by containing the following components (A) to (F): (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in the molecule; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms bonded to silicon atoms and is contained in an amount in which the ratio of the number of hydrogen atoms bonded to silicon atoms to the number of alkenyl groups in the component (A) is 0.1-2; (C) 4,000-7,000 parts by mass of a heat-conductive filler; (D) a catalytic amount of a platinum group metal catalyst; (E) 0.01-1 parts by mass of an addition reactio