Heat-conductive silicone composition
The purpose of the present invention, which has been developed in view of the foregoing circumstances, is to provide: a heat-conductive silicone composition in which an increase in viscosity is suppressed when a heat-conductive filler is highly filled; and a heat-conductive silicone cured product wh...
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creator | ITO, TAKANORI HIRONAKA, YUYA ENDO, AKIHIRO TSUKADA, JUNICHI MIYANO, MEGUMI ISHIHARA, YASUHISA |
description | The purpose of the present invention, which has been developed in view of the foregoing circumstances, is to provide: a heat-conductive silicone composition in which an increase in viscosity is suppressed when a heat-conductive filler is highly filled; and a heat-conductive silicone cured product which has good thermal conductivity and excellent handleability. The heat-conductive silicone composition is characterized by containing the following components (A) to (F): (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in the molecule; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms bonded to silicon atoms and is contained in an amount in which the ratio of the number of hydrogen atoms bonded to silicon atoms to the number of alkenyl groups in the component (A) is 0.1-2; (C) 4,000-7,000 parts by mass of a heat-conductive filler; (D) a catalytic amount of a platinum group metal catalyst; (E) 0.01-1 parts by mass of an addition reactio |
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The heat-conductive silicone composition is characterized by containing the following components (A) to (F): (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in the molecule; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms bonded to silicon atoms and is contained in an amount in which the ratio of the number of hydrogen atoms bonded to silicon atoms to the number of alkenyl groups in the component (A) is 0.1-2; (C) 4,000-7,000 parts by mass of a heat-conductive filler; (D) a catalytic amount of a platinum group metal catalyst; (E) 0.01-1 parts by mass of an addition reactio</description><language>chi ; eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230316&DB=EPODOC&CC=TW&NR=202311489A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230316&DB=EPODOC&CC=TW&NR=202311489A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ITO, TAKANORI</creatorcontrib><creatorcontrib>HIRONAKA, YUYA</creatorcontrib><creatorcontrib>ENDO, AKIHIRO</creatorcontrib><creatorcontrib>TSUKADA, JUNICHI</creatorcontrib><creatorcontrib>MIYANO, MEGUMI</creatorcontrib><creatorcontrib>ISHIHARA, YASUHISA</creatorcontrib><title>Heat-conductive silicone composition</title><description>The purpose of the present invention, which has been developed in view of the foregoing circumstances, is to provide: a heat-conductive silicone composition in which an increase in viscosity is suppressed when a heat-conductive filler is highly filled; and a heat-conductive silicone cured product which has good thermal conductivity and excellent handleability. 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subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | Heat-conductive silicone composition |
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