Modified epoxy resin, resin composition, cured article, laminated board for electric/electronic circuits, and method for producing modified epoxy resin
Provided are: a modified epoxy resin having excellent solubility and fluidability; a resin composition comprising the modified epoxy resin and a curing agent; a cured product of the resin composition, which has excellent dielectric properties and heat conductivity; and a laminated board for electric...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Provided are: a modified epoxy resin having excellent solubility and fluidability; a resin composition comprising the modified epoxy resin and a curing agent; a cured product of the resin composition, which has excellent dielectric properties and heat conductivity; and a laminated board for electric/electronic circuits. The modified epoxy resin is represented by general formula (1) and has an epoxy equivalent of 200 g/eq. or more and less than 5,000 g/eq. In the formula, X's independently represent a bivalent group, in which 70 mol% or more of the bivalent groups is a monocyclic or condensed polycyclic aromatic hydrocarbon group having 6 to 20 carbon atoms which is selected from the group consisting of a benzene ring group, a naphthalene ring group, an anthracene ring group and a phenanthrene ring group, and each of these monocyclic or condensed polycyclic aromatic hydrocarbon group may have a substituent. |
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