Epoxy resin, epoxy resin composition, and cured product thereof

An object of the present invention is to provide an expoxy resin composition that is capable of forming a cured product having good melt-kneadability at 100 DEG C or lower and excellent solvent solubility, heat resistance, thermolysis stability, thermal conductivity, and tracking resistance, and is useful for materials for the packaging and circuit boards of electronic devices/electronic parts. A solution to the above object is an epoxy resin represented by the following general formula (1), with an epoxy equivalent of 180 to 240/eq and a softening point in the range of 60 to 95 DEG C. In the formula, G represents a glycidyl group; A represents a single bond, an oxygen atom, a sulfur atom, -SO2-, -CO-, or a divalent hydrocarbon having 1 to 6 carbon atoms; n and m each independently represent a number from 0 to 20.