Plating film and plating film production method

The present invention provides a plating film that exhibits excellent adhesion with respect to a glass substrate. The plating film according to the present invention is characterized by having an oxide layer, an electroless plating film, and an electrolytic copper plating film in the stated order.

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Bibliographische Detailangaben
Hauptverfasser:	NAGAO, TOSHIMITSU, FUKU, SHUHEI, KATAYAMA, JUNICHI, HIROOKA, ASUKA, SAKATA, TOSHIHIKO, HAYAMIZU, MASAHITO, TSUKUDA, MAYU, SHIMADA, KAZUYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL PRINTED CIRCUITS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	The present invention provides a plating film that exhibits excellent adhesion with respect to a glass substrate. The plating film according to the present invention is characterized by having an oxide layer, an electroless plating film, and an electrolytic copper plating film in the stated order.