Semiconductor package and manufacturing method thereof

A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HSUEH, CHANG-JUNG, WANG, KUAN-MIN, CHANG, KUOIN, CHUANG, JUIANG, LIN, WEI-HUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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