Curable resin composition and electronic component device

A curable resin composition containing an epoxy resin and a phenolic curing agent at an equivalent ratio of the phenolic hydroxyl group of the phenolic curing agent to the epoxy group of the epoxy resin of 0.5 or more and less than 1.0.

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Bibliographische Detailangaben
Hauptverfasser:	NISHIYAMA, TOMOO, KIM, KIFA, YOKOKURA, AI, HATAKEYAMA, KEIICHI, KAN, DONCHORU, YAMAMOTO, TAKAYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A curable resin composition containing an epoxy resin and a phenolic curing agent at an equivalent ratio of the phenolic hydroxyl group of the phenolic curing agent to the epoxy group of the epoxy resin of 0.5 or more and less than 1.0.