Printed product, preparation method therefor, and use thereof

The present invention relates to a printed product, which comprises: a. a substrate; b. a primer layer located on the substrate, wherein the primer layer comprises an organic dielectric material; c. a metal conductive layer located on the primer layer; wherein the printed product further comprises a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AN, SHOU-MING, LIU, ER-WEI, SHEN, FANG-ZHONG, WANG, RONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLOUR PRINTING CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SPRAYING OR ATOMISING IN GENERAL STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	The present invention relates to a printed product, which comprises: a. a substrate; b. a primer layer located on the substrate, wherein the primer layer comprises an organic dielectric material; c. a metal conductive layer located on the primer layer; wherein the printed product further comprises a hybrid layer between the primer layer and the metal conductive layer, wherein the hybrid layer comprises materials from the primer layer and the metal conductive layer. In addition, the present invention further relates to a method for preparing the printed product and an electronic device comprising the printed product. The metal conductive layer in the printed product of the present invention has excellent uniformity in thickness; good adhesion between the primer layer and the conductive layer; and the printed product of the present invention has excellent EMI shielding effects, such that the printed product can be used in high frequency applications such as 5G applications.