Method for cleaning and drying wafer

A method for cleaning and drying wafer is provided to solve the problem that the conventional process of cleaning and drying wafer causes collapsing of the microstructure of transistor on the wafer. The method includes an obliquing step, a washing step and a drying step. The obliquing step is tiltin...

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Bibliographische Detailangaben
Hauptverfasser:	YANG, CHIHNG, LIN, CHUNU, WU, PEI-YU, CHEN, WENUNG, CHANG, TINGANG, KUO, CHUAN-WEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for cleaning and drying wafer is provided to solve the problem that the conventional process of cleaning and drying wafer causes collapsing of the microstructure of transistor on the wafer. The method includes an obliquing step, a washing step and a drying step. The obliquing step is tilting a processing component so that a processing surface of the processing component is face up. The processing surface and horizontal plane have an inclination angle. The washing step is injecting a cleaning solution into the processing surface. The drying step is increasing ambient temperature around the processing component to volatilize the cleaning solution staying on the processing surface.