Pad-in-a-bottle (PIB) technology for copper barrier slurries

A novel pad-in-a-bottle (PIB) technology for advanced chemical-mechanical planarization (CMP) copper barrier CMP compositions, systems and processes has been disclosed for use with polyurethane-based polishing pads having a plurality of asperities. The CMP composition comprises abrasives, polyuretha...

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Bibliographische Detailangaben
Hauptverfasser: PHILIPOSSIAN, ARA, SCHLUETER, JAMES ALLEN, LANGAN, JOHN G, VACASSY, ROBERT, SHI, XIAOBO, O'NEILL, MARK LEONARD, SAMPURNO, YASA
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A novel pad-in-a-bottle (PIB) technology for advanced chemical-mechanical planarization (CMP) copper barrier CMP compositions, systems and processes has been disclosed for use with polyurethane-based polishing pads having a plurality of asperities. The CMP composition comprises abrasives, polyurethane beads, and surfactant. The polishing pad lifetime increasing is achieved using PIB-type Cu barrier CMP polishing composition.