Ceramic bonding method and formula

The invention is a ceramic bonding method and formula, which uses a ceramic bonding formula containing ceramic powder, clay and glaze, and with high-temperature kiln treatment to achieve the bonding between two different ceramic parts, or the repair of damaged contacts in ceramic parts. In particula...

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Bibliographische Detailangaben
1. Verfasser: WU, XINGANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention is a ceramic bonding method and formula, which uses a ceramic bonding formula containing ceramic powder, clay and glaze, and with high-temperature kiln treatment to achieve the bonding between two different ceramic parts, or the repair of damaged contacts in ceramic parts. In particular, the invention uses a sticky glaze material added to the clay, and also adds a cooked powder that has been sintered and ground at high temperature as ceramic powder, which greatly reduces the degree of shrinkage during high-temperature sintering and facilitates the bonding of ceramics, increasing the compactness and strengthening the stability.