Method for mounting electronic component and partial shield substrate for electronic component mounting

This method for mounting electronic components includes a substrate for electronic component mounting, which has a base material, a plurality of solder parts on the base material, and a plurality of electronic components arranged in contact with the plurality of solder parts in correspondence with t...

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Hauptverfasser: NAKAMURA, TAKASHI, UENO, NAOKO, NISHIOKA, MASATERU, UEMURA, SEI
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Sprache:chi ; eng
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creator NAKAMURA, TAKASHI
UENO, NAOKO
NISHIOKA, MASATERU
UEMURA, SEI
description This method for mounting electronic components includes a substrate for electronic component mounting, which has a base material, a plurality of solder parts on the base material, and a plurality of electronic components arranged in contact with the plurality of solder parts in correspondence with the plurality of solder parts, being irradiated with microwaves while an electromagnetic wave shield is applied to some of the plurality of solder parts, and at least a solder part to which the electromagnetic wave shield is not applied being heated and melted by the action of the magnetic field of a standing wave formed by the microwave irradiation.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Method for mounting electronic component and partial shield substrate for electronic component mounting
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