Method for mounting electronic component and partial shield substrate for electronic component mounting

This method for mounting electronic components includes a substrate for electronic component mounting, which has a base material, a plurality of solder parts on the base material, and a plurality of electronic components arranged in contact with the plurality of solder parts in correspondence with t...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA, TAKASHI, UENO, NAOKO, NISHIOKA, MASATERU, UEMURA, SEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	This method for mounting electronic components includes a substrate for electronic component mounting, which has a base material, a plurality of solder parts on the base material, and a plurality of electronic components arranged in contact with the plurality of solder parts in correspondence with the plurality of solder parts, being irradiated with microwaves while an electromagnetic wave shield is applied to some of the plurality of solder parts, and at least a solder part to which the electromagnetic wave shield is not applied being heated and melted by the action of the magnetic field of a standing wave formed by the microwave irradiation.