Lead frame including lead with groove formed therein
According to an aspect of the present disclosure, provided is a lead frame including a plurality of lead with a lead groove formed therein; and a dambar arranged between the leads to connect the leads, wherein a thickness of the dambar arranged between the leads has at least two thickness values, an...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | According to an aspect of the present disclosure, provided is a lead frame including a plurality of lead with a lead groove formed therein; and a dambar arranged between the leads to connect the leads, wherein a thickness of the dambar arranged between the leads has at least two thickness values, and a dambar groove is formed between a thickest portion of the dambar and the lead neighboring the thickest portion of the dambar. |
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