Substrate polishing system

A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, an...

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Hauptverfasser: LEE, SEUNG-EUN, CHAE, HEE-SUNG, YUN, GEUN-SIK
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate transferred by the substrate transfer unit.