Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

A resin composition according to the present invention includes: (A) a bismaleimide compound containing a constituent unit represented by formula (1) and a maleimide group at both terminals of a molecular chain; (B) a compound containing at least one carboxylic group; and (C) a photocuring initiator...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKEDA, MAO, YOSHIZAWA, ERI, YAMAMOTO, KAZUYOSHI, MIZUGUCHI, TAKAHUMI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A resin composition according to the present invention includes: (A) a bismaleimide compound containing a constituent unit represented by formula (1) and a maleimide group at both terminals of a molecular chain; (B) a compound containing at least one carboxylic group; and (C) a photocuring initiator. (In formula (1), R1 represents a C1-C16 linear or branched alkylene group, or a C2-C16 linear or branched alkenylene group. R2 represents a C1-C16 linear or branched alkylene group, or a C2-C16 linear or branched alkenylene group. R3 each independently represents a hydrogen atom, a C1-C16 linear or branched alkylene group, or a C2-C16 linear or branched alkenylene group. n1 each independently represents an integer of 1-4. n2 each independently represents an integer of 1-4.).