Hot-rolled copper alloy sheet and sputtering target

This hot-rolled copper alloy sheet comprises 0.2-2.1 mass% of Mg, 0.4-5.7 mass% of Al, and at most 0.01 mass% of Ag, with the remainder made up of Cu and unavoidable impurities. The area ratio of the Cube orientation (area ratio of crystal orientation) as measured by the EBSD method is at most 5%, a...

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Bibliographische Detailangaben
Hauptverfasser:	TANI, U, TSUGAWA, YASUHIRO, MAKI, KAZUNARI, NAKASATO, YOSUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CASTING CASTING OF METALS CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS POWDER METALLURGY PUNCHING METAL ROLLING OF METAL SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	This hot-rolled copper alloy sheet comprises 0.2-2.1 mass% of Mg, 0.4-5.7 mass% of Al, and at most 0.01 mass% of Ag, with the remainder made up of Cu and unavoidable impurities. The area ratio of the Cube orientation (area ratio of crystal orientation) as measured by the EBSD method is at most 5%, and the average KAM value when the boundary between adjacent pixels whose azimuth difference is at least 5 DEG serves as a crystal boundary is at most 2.0. The average crystal grain diameter [mu] at the center of the hot-rolled copper alloy sheet in the thickness direction is at most 40 [mu]m.