Laminate and manufacturing method thereof characterized in that a thermoplastic resin layer, a primer layer, and a metal layer are sequentially laminated on the insulating substrate

The present invention provides a laminate having a smooth interface between an insulating substrate having a thermoplastic resin on its outermost layer and a metal layer formed thereon, and excellent in adhesion between an insulator and the metal layer, and further provides a manufacturing thereof a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUKAZAWA, NORIMASA, SHIRAKAMI, JUN, FURUTANI, AKINORI, FUJIKAWA, WATARU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a laminate having a smooth interface between an insulating substrate having a thermoplastic resin on its outermost layer and a metal layer formed thereon, and excellent in adhesion between an insulator and the metal layer, and further provides a manufacturing thereof and a printed wiring board manufactured by using the laminate. A laminate excellent in adhesion can be found by using the following laminate, which is characterized in that a thermoplastic resin layer (B), a primer layer (C), and a metal layer (D) are sequentially laminated on an insulating substrate (A).