Wafer scrubbing device

A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LIN, WAN-TI, LIN, TANGI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LIN, WAN-TI
LIN, TANGI
description A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend along a second axis. The first spray pipe is disposed above the two scrubbing rollers, a projection of the first spray pipe on each of the scrubbing rollers crosses the scrubbing roller, and there is a non-zero angle between the first spray pipe and the second axis.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202300235A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202300235A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202300235A3</originalsourceid><addsrcrecordid>eNrjZBALT0xLLVIoTi4qTUrKzEtXSEkty0xO5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGxgZAbOpoTIwaAJZ8IXc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer scrubbing device</title><source>esp@cenet</source><creator>LIN, WAN-TI ; LIN, TANGI</creator><creatorcontrib>LIN, WAN-TI ; LIN, TANGI</creatorcontrib><description>A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend along a second axis. The first spray pipe is disposed above the two scrubbing rollers, a projection of the first spray pipe on each of the scrubbing rollers crosses the scrubbing roller, and there is a non-zero angle between the first spray pipe and the second axis.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230101&amp;DB=EPODOC&amp;CC=TW&amp;NR=202300235A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230101&amp;DB=EPODOC&amp;CC=TW&amp;NR=202300235A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, WAN-TI</creatorcontrib><creatorcontrib>LIN, TANGI</creatorcontrib><title>Wafer scrubbing device</title><description>A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend along a second axis. The first spray pipe is disposed above the two scrubbing rollers, a projection of the first spray pipe on each of the scrubbing rollers crosses the scrubbing roller, and there is a non-zero angle between the first spray pipe and the second axis.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBALT0xLLVIoTi4qTUrKzEtXSEkty0xO5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGxgZAbOpoTIwaAJZ8IXc</recordid><startdate>20230101</startdate><enddate>20230101</enddate><creator>LIN, WAN-TI</creator><creator>LIN, TANGI</creator><scope>EVB</scope></search><sort><creationdate>20230101</creationdate><title>Wafer scrubbing device</title><author>LIN, WAN-TI ; LIN, TANGI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202300235A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN, WAN-TI</creatorcontrib><creatorcontrib>LIN, TANGI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN, WAN-TI</au><au>LIN, TANGI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer scrubbing device</title><date>2023-01-01</date><risdate>2023</risdate><abstract>A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend along a second axis. The first spray pipe is disposed above the two scrubbing rollers, a projection of the first spray pipe on each of the scrubbing rollers crosses the scrubbing roller, and there is a non-zero angle between the first spray pipe and the second axis.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202300235A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
title Wafer scrubbing device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T12%3A57%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIN,%20WAN-TI&rft.date=2023-01-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202300235A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true