Wafer scrubbing device
A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend...
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creator | LIN, WAN-TI LIN, TANGI |
description | A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend along a second axis. The first spray pipe is disposed above the two scrubbing rollers, a projection of the first spray pipe on each of the scrubbing rollers crosses the scrubbing roller, and there is a non-zero angle between the first spray pipe and the second axis. |
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The two scrubbing rollers are stacked up and down along the first axis and extend along a second axis. The first spray pipe is disposed above the two scrubbing rollers, a projection of the first spray pipe on each of the scrubbing rollers crosses the scrubbing roller, and there is a non-zero angle between the first spray pipe and the second axis.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230101&DB=EPODOC&CC=TW&NR=202300235A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230101&DB=EPODOC&CC=TW&NR=202300235A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, WAN-TI</creatorcontrib><creatorcontrib>LIN, TANGI</creatorcontrib><title>Wafer scrubbing device</title><description>A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend along a second axis. The first spray pipe is disposed above the two scrubbing rollers, a projection of the first spray pipe on each of the scrubbing rollers crosses the scrubbing roller, and there is a non-zero angle between the first spray pipe and the second axis.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBALT0xLLVIoTi4qTUrKzEtXSEkty0xO5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGxgZAbOpoTIwaAJZ8IXc</recordid><startdate>20230101</startdate><enddate>20230101</enddate><creator>LIN, WAN-TI</creator><creator>LIN, TANGI</creator><scope>EVB</scope></search><sort><creationdate>20230101</creationdate><title>Wafer scrubbing device</title><author>LIN, WAN-TI ; LIN, TANGI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202300235A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN, WAN-TI</creatorcontrib><creatorcontrib>LIN, TANGI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN, WAN-TI</au><au>LIN, TANGI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer scrubbing device</title><date>2023-01-01</date><risdate>2023</risdate><abstract>A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend along a second axis. The first spray pipe is disposed above the two scrubbing rollers, a projection of the first spray pipe on each of the scrubbing rollers crosses the scrubbing roller, and there is a non-zero angle between the first spray pipe and the second axis.</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
recordid | cdi_epo_espacenet_TW202300235A |
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subjects | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING |
title | Wafer scrubbing device |
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