Wafer scrubbing device

Wafer scrubbing device

A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LIN, WAN-TI, LIN, TANGI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:A wafer scrubbing device includes a driving roller, two scrubbing rollers and a first spray pipe. The driving roller rotates along a first axis. The two scrubbing rollers are disposed on one side of the driving roller. The two scrubbing rollers are stacked up and down along the first axis and extend along a second axis. The first spray pipe is disposed above the two scrubbing rollers, a projection of the first spray pipe on each of the scrubbing rollers crosses the scrubbing roller, and there is a non-zero angle between the first spray pipe and the second axis.