Photosensitive resin composition, photoresist comprising same, display device comprising same, and method of low-temperature curing photosensitive resin composition

The present disclosure relates to a photosensitive resin composition, a photoresist, a display device, and a method of low-temperature curing the photosensitive resin composition.

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Bibliographische Detailangaben
Hauptverfasser:	LEE, SOO-HEE, LEE, YOUNG-HEE, JUNG, HYUN-JIN, KIM, DAE-HYUN, NOH, BYEONG-IL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CALCULATING CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present disclosure relates to a photosensitive resin composition, a photoresist, a display device, and a method of low-temperature curing the photosensitive resin composition.