Curable resin multilayer body, dry film, cured product and electronic component

The present invention provides a curable resin multilayer body which is capable of easily producing an insulating layer that has low dielectric characteristics, while exhibiting excellent adhesion (peel strength) with respect to a conductor layer. A curable resin multilayer body which comprises a first resin layer that is formed of a first curable composition, and a second resin layer that is superposed on the first resin layer, while being formed of a second curable composition, wherein: the second resin layer has a thickness of 5% to 35% with resect to the total thickness of the first resin layer and the second resin layer; the first curable composition contains (A1) a polyphenylene ether and a filler; the content ratio (MB1) of the filler as the total solid content is 30% by mass or more; the second curable composition contains (A2) a polyphenylene ether; the content ratio (MB2) of a filler as the total solid content is 40% by mass or less; MB1 > MB2 is satisfied; and the components (A1) and (A2) have a sl