Pocket structures for tape and reel semiconductor picking and associated systems and methods

A carrier tape configured to releasably retain one or more semiconductor devices and associated systems and methods are disclosed herein. The carrier tape includes an uppermost surface and at least one semiconductor device pocket. The pocket has a top edge at the uppermost surface, longitudinal footprint, a bottom surface at beneath the uppermost surface, and a hole on the bottom surface. A grid structure is positioned within the device pocket. The grid structure is vapor-permeable, allowing air to move between open spaces in the grid. A flexible layer is disposed over the grid structure, dividing the pocket into a first portion above the flexible layer and a second portion beneath the flexible layer. The flexible layer is configured to at least partially deform into the open spaces of the grid structure when air is removed from the second portion through the hole.