Process cell for field guided post exposure bake process

Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module and includes an uppe...

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Bibliographische Detailangaben
Hauptverfasser:	LUBOMIRSKY, DMITRY, TSO, ALAN L, HANSON, KYLE M, SUN, JIA-YI, KOZHIKKALKANDI, RAHUL, BUCHBERGER JR., DOUGLAS A, LIANG, QIWEI, YIEH, ELLIE Y, HUANG, LANCE LAN-SI, MCHUGH, PAUL R, ALEX, NITHIN THOMAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module and includes an upper portion with an electrode and a base portion which is configured to support a substrate on a substrate support surface. The upper portion and the base portion are actuated toward and away from one another using one or more arms and form a process volume. The process volume is filled with a process fluid and the processing module is rotated about an axis. An electric field is applied to the substrate by the electrode before the process fluid is drained from the process volume.