Chip package unit and chip packaging method
The present invention discloses a chip package unit, which includes: a substrate; at least one chip, disposed on the substrate; a package material, enclosing the substrate and the chip; and at least one curing layer of thermal paste, formed by curing the thermal paste on a top of the package materia...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present invention discloses a chip package unit, which includes: a substrate; at least one chip, disposed on the substrate; a package material, enclosing the substrate and the chip; and at least one curing layer of thermal paste, formed by curing the thermal paste on a top of the package material or a back side of the chip in a distribution pattern. |
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