Wafer bonding apparatus

A wafer bonding apparatus includes a base, at least two first positioning components, two second positioning components, a heat source and a soft pressing component. The base has a carrying region, the carrying region is adapted to carry two wafers stacked with each other, and a periphery of each of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HO, CHINGUNG, LIN, WAN-TI, WU, CHIA-SHENG, LIN, TANGI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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