Wafer bonding apparatus
A wafer bonding apparatus includes a base, at least two first positioning components, two second positioning components, a heat source and a soft pressing component. The base has a carrying region, the carrying region is adapted to carry two wafers stacked with each other, and a periphery of each of...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A wafer bonding apparatus includes a base, at least two first positioning components, two second positioning components, a heat source and a soft pressing component. The base has a carrying region, the carrying region is adapted to carry two wafers stacked with each other, and a periphery of each of the wafers includes an arc segment and a straight line segment. The two first positioning components and the two second positioning components are disposed on the base and surround the carrying region. The two first positioning components are adapted to lean against the arc segment and the two second positioning components are adapted to lean against the straight line segment, such that the two wafers are positioned and the two straight lines are aligned to each other. The heat source is connected to the base and adapted to heat the carrying region, such that a temperature of a bonding material between the two wafers is raised. The soft pressing component is disposed above the carrying region and is capable of bei |
|---|