Wafer bonding apparatus

Wafer bonding apparatus

A wafer bonding apparatus includes a base, at least two first positioning components, two second positioning components, a heat source and a soft pressing component. The base has a carrying region, the carrying region is adapted to carry two wafers stacked with each other, and a periphery of each of...

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Hauptverfasser: HO, CHINGUNG, LIN, WAN-TI, WU, CHIA-SHENG, LIN, TANGI
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HO, CHINGUNG
LIN, WAN-TI
WU, CHIA-SHENG
LIN, TANGI
description A wafer bonding apparatus includes a base, at least two first positioning components, two second positioning components, a heat source and a soft pressing component. The base has a carrying region, the carrying region is adapted to carry two wafers stacked with each other, and a periphery of each of the wafers includes an arc segment and a straight line segment. The two first positioning components and the two second positioning components are disposed on the base and surround the carrying region. The two first positioning components are adapted to lean against the arc segment and the two second positioning components are adapted to lean against the straight line segment, such that the two wafers are positioned and the two straight lines are aligned to each other. The heat source is connected to the base and adapted to heat the carrying region, such that a temperature of a bonding material between the two wafers is raised. The soft pressing component is disposed above the carrying region and is capable of bei
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Wafer bonding apparatus
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