Fluid flow control system comprising a manifold assembly

Systems for processing articles are essential for semiconductor fabrication. In one embodiment, a system is disclosed comprising a plurality of fluid supplies configured to supply process fluids, a plurality of apparatuses for controlling flow, a plurality of mounting substrates, a vacuum manifold f...

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Bibliographische Detailangaben
Hauptverfasser:	PHILIP, RYAN BARROS, GREG, PATRICK MULLIGAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CONTROLLING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING PHYSICS PIPES REGULATING SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	Systems for processing articles are essential for semiconductor fabrication. In one embodiment, a system is disclosed comprising a plurality of fluid supplies configured to supply process fluids, a plurality of apparatuses for controlling flow, a plurality of mounting substrates, a vacuum manifold fluidly coupled to the plurality of mounting substrates, an outlet manifold fluidly coupled to the plurality of mounting substrates, a vacuum source fluidly coupled to the vacuum manifold, and a processing chamber fluidly coupled to the outlet manifold. The plurality of apparatuses for controlling flow have a bleed port and an outlet. The outlets of the plurality of apparatuses are fluidly coupled to corresponding outlet ports of the plurality of mounting substrates. The bleed ports of the plurality of apparatuses are fluidly coupled to the corresponding vacuum ports of the plurality of mounting substrates.