Sputtering device

A sputtering device is provided with: a first target holder and a second target holder respectively holding a first target and a second target with surfaces thereof opposing each other; a substrate holder provided laterally of a plasma generating region between the first target and the second target...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IKUHARA, SHIRO, SATOH, KAZUO, OGAWA, SOICHI, KONDO, YUSUKE, EBE, AKINORI, IWASAKI, SHINICHI, KAKEHI, YOSHIHARU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A sputtering device is provided with: a first target holder and a second target holder respectively holding a first target and a second target with surfaces thereof opposing each other; a substrate holder provided laterally of a plasma generating region between the first target and the second target respectively being held by the first target holder and the second target holder; a first main magnetic field generating portion and a second main magnetic field generating portion which are respectively provided on the back side of the first target holder and the second target holder, in which magnets are arranged with mutually opposite poles thereof opposing each other, and which respectively generate a first main magnetic field and a second main magnetic field on the surfaces of the first target and the second target being held by the respective holders; a power supply for applying predetermined potentials to the first target holder and the second target holder to generate an electric field in the plasma generat