Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device

The present invention relates to an adhesive paste containing a curable organopolysiloxane compound (A), wherein a cured product, obtained by heat-curing the adhesive paste at 80 DEG C for 20 hours and then further heat-curing the adhesive paste at 100 DEG C for 20 hours, has a minimum storage modul...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SATO, AKIKO, MIYAWAKI, MANABU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to an adhesive paste containing a curable organopolysiloxane compound (A), wherein a cured product, obtained by heat-curing the adhesive paste at 80 DEG C for 20 hours and then further heat-curing the adhesive paste at 100 DEG C for 20 hours, has a minimum storage modulus Emin of less than 90 MPa in a temperature range of 150 DEG C to 180 DEG C, and the adhesive strength at 100 DEG C, between a cured product obtained by heat-curing the adhesive paste at 170 DEG C for 2 hours and a silver-plated copper plate, is 5 N/mm□ or more. According to the present invention, provided are: an adhesive paste which can reduce or prevent cracking or chipping of a semiconductor device in a wire bonding process, and can reduce or prevent peeling of the semiconductor device; a method for using the adhesive paste as an adhesive for a semiconductor device fixing material; and a method for manufacturing a semiconductor device using the adhesive paste as an adhesive for a semiconductor device fixing ma